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| ZXBM2004资料 | |
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ZXBM2004 PDF Download |
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File Size : 116 KB
Manufacturer:ZETEX Description:Thermocompression bonding is recommended. Welding or conductive epoxy may also be used. For additional information see Application Note 979, The Handling and Bonding of Beam Lead Devices Made Easy, or Application Note 992, Beam Lead Attachment Methods, or Application Note 993, Beam Lead Device Bonding to Soft Substrates. |
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| 相关型号 | |
| ◆ ZXFV204 | |
| ◆ ZXBM2004 | |
| ◆ ZXBM1017 | |
| ◆ ZXBM1015 | |
| ◆ ZT751 | |
| ◆ ZR36862PQCG-B | |
| ◆ ZR36778HQCG | |
| ◆ ZR36748PQC | |
| ◆ ZR36731PQC | |
| ◆ ZR36721PQCG | |
| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：ZXBM2004 厂 家：ZETEX 封 装：SSOP 批 号：06+ 数 量：11 说 明：欢迎查询 |
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运 费：10 所在地：深圳 新旧程度： |
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| 联系人：连小姐/陈生 |
| 电 话：0755-61329316,61329587 |
| 手 机：13823255898 |
| QQ：1139119726,514884760 |
| MSN：liancarol@live.cn |
| 传 真：0755-61329587 |
| EMail：liancarol@126.com |
| 公司地址： 深圳市中航新亚洲电子城一期1A010 |
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